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快速满足不同行业下的自动化应用需求

数码行业激光加工解决方案

2025/09/05 355

     作为专注于激光应用技术研发的高新技术企业,我们深耕消费电子领域多年,针对TWS耳机、电容笔、智能穿戴、保护壳等精密数码配件,提供涵盖激光打标、精密焊接、微尺度切割的全方位解决方案。我们致力于通过先进的激光工艺,助力客户实现配件产品的外观升级、功能强化与高效智能制造。

 

As a high-tech enterprise dedicated to laser application technology, we have years of experience in the consumer electronics field. We provide comprehensive laser processing solutions covering marking, precision welding, and micro-scale cutting for precision digital accessories such as TWS earphones, stylus pens, smart wearables, and protective cases. We are committed to helping customers achieve appearance upgrades, functional enhancements, and efficient intelligent manufacturing for accessory products through advanced laser processes.

一、音频类配件精密加工

I. Precision Processing for Audio Accessories

TWS耳机激光打标

TWS耳机充电仓/耳机柄激光精密打标

TWS Earphone Case/Stem Laser Precision Marking

在塑料、金属耳机表面进行Logo、型号等高精度永久打标。

High-precision permanent marking of logos, model numbers, etc., on plastic and metal earphone surfaces.

核心技术要点

Core Technical Points

紫外激光器(塑料)/光纤激光器(金属),极小光斑,高精度振镜扫描。

UV laser (plastic) / Fiber laser (metal),极小 spot size, high-precision galvanometer scanning.

  • 极细标记:可实现<0.5mm的微小字符和精细Logo,适应紧凑空间
  • 高附着力:标记耐磨、耐汗渍、耐酒精擦拭,与产品寿命同步
  • 提升高端质感:哑光/亮光对比效果,增强产品辨识度与价值感
  • Ultra-fine Marking: Achieves <0.5mm tiny characters and fine logos,适应 compact spaces
  • High Adhesion: Marks are wear-resistant, sweat-proof, alcohol-wipe resistant,同步 product lifespan
  • Enhances Premium Feel: Matte/gloss contrast effects boost product recognition and perceived value
耳机金属件切割

金属耳机框架/装饰件激光精密切割

Metal Earphone Frame/Decoration Laser Precision Cutting

耳机金属充电触点片、头梁镂空图案、装饰片的轮廓切割。

Contour cutting of metal charging contact plates, headband镂空 patterns, and decorative pieces.

核心技术要点

Core Technical Points

光纤激光器(100-300W),氮气辅助精密微切割,高精度平台。

Fiber laser (100-300W), nitrogen-assisted precision micro-cutting, high-precision stage.

  • 超高精度:切割轮廓精度达±0.02mm,保证小尺寸零件装配顺畅
  • 无毛刺不变形:切割边缘光滑,可直接使用,免去二次去毛刺工序
  • 微细结构加工:可加工宽度<0.2mm的精细镂空纹理
  • Ultra-high Precision: Cutting contour accuracy up to ±0.02mm, ensures smooth assembly of small parts
  • Burr-free & Undeformed: Smooth cut edges, ready for use, eliminates secondary deburring
  • Micro-structure Processing: Capable of fine镂空 textures with widths <0.2mm
充电接口激光焊接

充电头/数据线接口外壳激光焊接与打标

Charger/Data Cable Interface Housing Laser Welding & Marking

USB-C等接口金属外壳密封焊接;数据线表面规格信息打标。

Sealing welding of metal housings for USB-C等 interfaces;规格 information marking on cable surfaces.

核心技术要点

Core Technical Points

光纤激光器(焊接)/紫外激光器(打标),旋转焊接工装与线材送料。

Fiber laser (welding) / UV laser (marking), rotary welding fixture and wire feeding mechanism.

  • 焊接牢固密封:确保接口耐插拔、防汗液腐蚀,提升产品可靠性
  • 线材标记永久:标记在弯曲、摩擦下不脱落,清晰可读,利于售后追溯
  • 高速在线作业:可与装配线联动,实现实时打标,提升效率
  • Strong & Sealed Welding: Ensures interface durability against plugging/unplugging and sweat corrosion, enhances reliability
  • Permanent Cable Marking: Marks won't脱落 under bending/friction,清晰 readable, aids after-sales traceability
  • High-speed Online Operation: Can link with assembly line for real-time marking,提高 efficiency

二、输入/交互类配件加工

II. Input/Interaction Accessory Processing

电容笔激光焊接

电容笔精密笔头/金属组件激光焊接

Stylus Pen Precision Tip/Metal Component Laser Welding

金属笔尖与传感组件连接;笔身装饰环与壳体的密封焊接。

Connecting metal tips to sensor assemblies; sealing welding of decorative rings to pen bodies.

核心技术要点

Core Technical Points

光纤/半导体激光器,精密点焊/环缝焊,同轴视觉与能量闭环控制。

Fiber/semiconductor laser, precision spot/circumferential seam welding, coaxial vision & closed-loop energy control.

  • 焊缝极小且牢固:焊点直径可控在0.3-0.8mm,保证结构强度与信号导通
  • 无表面损伤:热影响区极小,不影响笔身外观及握持手感
  • 高一致性:确保每支笔的书写精度与压力感应一致性
  • Minute & Strong Weld: Weld spot diameter controllable at 0.3-0.8mm, ensures structural strength and signal conduction
  • No Surface Damage: Minimal heat-affected zone,不影响 pen appearance and grip feel
  • High Consistency: Ensures writing accuracy and pressure sensing consistency for every pen
镜头保护环加工

镜头保护环/装饰圈激光微焊接与打标

Lens Protection Ring/Decoration Laser Micro-welding & Marking

手机镜头金属保护环的精密焊接与表面刻度、标识打标。

Precision welding and surface scale/logo marking for手机 lens metal protection rings.

核心技术要点

Core Technical Points

光纤激光器,准同步焊接与高对比度打标,微间隙焊接能力。

Fiber laser, quasi-simultaneous welding & high-contrast marking, micro-gap welding capability.

  • 焊接强度高、外观好:焊接后无需处理,焊缝美观且能承受跌落冲击
  • 标记清晰耐磨:在曲面、狭小空间内实现清晰、高对比度的永久标记
  • 保护光学组件:极低热输入,避免焊接热量影响内部精密镜头与传感器
  • High Strength & Good Appearance: No post-weld treatment needed, aesthetic seams withstand drop impact
  • Clear & Wear-resistant Marking: Achieves clear, high-contrast permanent marks on curved, confined surfaces
  • Protects Optical Components: Ultra-low heat input avoids affecting internal精密 lenses and sensors
柔性电路板激光切割

数码配件内部FPC(柔性电路板)激光切割

Digital Accessory Internal FPC (Flexible PCB) Laser Cutting

耳机、手环内部FPC的外形切割、金手指开窗、开槽。

Contour cutting, finger opening, and slotting for internal FPCs in earphones, bands, etc.

核心技术要点

Core Technical Points

紫外激光器(5-15W),多层材料选择性切割,CCD视觉对位。

UV laser (5-15W), selective cutting of multilayer materials, CCD vision alignment.

  • 无机械应力:避免传统冲切导致的FPC变形、分层或铜箔损伤
  • 高精度开窗:精准去除覆盖膜露出焊盘,窗口边缘整齐,无铜箔翻卷
  • 灵活性高:适合小批量、多品种、高密度的FPC样品与生产
  • No Mechanical Stress: Avoids FPC deformation, delamination, or copper foil damage caused by traditional punching
  • High-precision Window Opening: Precisely removes coverlay to expose pads, neat window edges, no copper卷起
  • High Flexibility: Suitable for small-batch, multi-variety, high-density FPC samples and production

三、保护与穿戴类配件加工

III. Protection & Wearable Accessory Processing

硅胶保护套激光加工

耳机/配件硅胶保护套激光精密镂空与打标

Earphone/Accessory Silicone Case Laser Precision镂空 & Marking

在硅胶保护套上镂空按键孔、镜头圈、装饰图案;表面打标Logo。

镂空 button holes, lens rings, decorative patterns on silicone cases; surface logo marking.

核心技术要点

Core Technical Points

CO₂激光器(30-60W),气化切割与表面标刻,专用防粘尘装置。

CO₂ laser (30-60W), vaporization cutting & surface engraving,专用 anti-dust-adhesion device.

  • 切口光滑无毛边:无传统刀模冲压的拉伸毛边,手感顺滑
  • 复杂图案一次成型:可直接切割复杂异形孔和精细花纹,设计自由度高
  • 环保无污染:替代传统丝印,无需油墨,无VOCs排放
  • Smooth Cut, No Burrs: No stretch burrs from traditional die cutting, smooth手感
  • Complex Patterns in One Step: Directly cuts complex异形 holes and fine patterns, high design freedom
  • Eco-friendly & Pollution-free: Replaces traditional screen printing, no ink, no VOC emissions
智能表带激光加工

智能手表/手环表带激光打标与切割

Smart Watch/Band Strap Laser Marking & Cutting

在多种材质表带上打标序列号、个性化ID;切割扣孔与轮廓。

Marking serial numbers, personalized IDs on various material straps; cutting buckle holes and contours.

核心技术要点

Core Technical Points

CO₂激光器(非金属)/光纤激光器(金属),自动对焦与材料数据库。

CO₂ laser (non-metal) / Fiber laser (metal), auto-focus and material database.

  • 适应多材料:同一平台可处理橡胶、织物、皮革、金属等多种材质表带
  • 个性化定制:轻松实现姓名、图案等个性化标记,满足C2M需求
  • 环保耐久:标记永久不脱落、不褪色,耐汗水、日晒和磨损
  • Multi-material Adaptability: One platform handles rubber, fabric, leather, metal, and other strap materials
  • Personalized Customization: Easily实现 personalized marks like names and patterns, meets C2M demand
  • Eco-friendly & Durable: Marks永久不脱落,不褪色, resistant to sweat, sunlight, and wear
AR/VR眼镜激光加工

AR/VR眼镜镜框与装饰件激光加工

AR/VR Glasses Frame & Decoration Laser Processing

轻质合金镜框的轻量化镂空切割;塑胶镜腿纹理打标与透气孔加工。

Lightweight镂空 cutting of alloy frames; texture marking and vent hole processing on plastic temples.

核心技术要点

Core Technical Points

光纤激光器(金属)/紫外激光器(塑胶),3D动态聚焦与机器人集成。

Fiber laser (metal) / UV laser (plastic), 3D dynamic focus and robot integration.

  • 实现复杂轻量化结构:可加工传统工艺难以实现的异形减重孔与复杂曲面
  • 精细表面处理:在曲面塑胶件上实现亚光纹理、Logo等,提升质感
  • 高集成度加工:一台设备可完成多种材料和工艺的加工,节省空间与成本
  • Achieves Complex Lightweight Structures: Processes异形 weight-reduction holes and complex curves difficult for传统 processes
  • Fine Surface Treatment: Achieves matte textures, logos, etc., on curved plastic parts, enhances质感
  • Highly Integrated Processing: One machine handles multiple materials and processes, saves space & cost

方案核心优势

Core Advantages of the Solution

极致精密与微尺度加工能力

Ultimate Precision & Micro-scale Processing Capability

针对数码配件“小而精”的特点,专注解决毫米/微米级精密加工难题,实现微细Logo、微型焊点、高精度切割,满足消费电子对极致精度的要求。

Focuses on solving毫米/micron-level precision challenges for "small and精密" accessories, achieving micro-logos,微型焊点, and high-precision cutting to meet consumer electronics' extreme accuracy demands.

多材料适应性与卓越外观处理

Multi-material Adaptability & Excellent Appearance Treatment

全面覆盖塑料、硅胶、金属、FPC等材料,擅长实现高颜值打标与纹理处理,显著提升产品的外观质感、品牌辨识度和个性化潜力。

Covers plastics, silicone, metals, FPC, etc., excels at high-appearance marking and texture treatment, significantly enhancing product look-and-feel, brand recognition, and personalization potential.

提升产品可靠性与功能性

Enhances Product Reliability & Functionality

通过高强度精密焊接保障结构牢固与密封性;通过高精度无损切割确保内部组件功能与装配可靠性,直接贡献于产品更长寿命与更稳定性能。

High-strength precision welding ensures structural integrity and sealing; high-precision无损 cutting ensures internal component functionality and assembly reliability, directly contributing to longer product lifespan and more stable performance.

赋能柔性化与个性化智能制造

Empowers Flexible & Personalized Smart Manufacturing

激光加工数字化、无模具、换产快的特点,完美契合数码配件品类多、迭代快的趋势,支持“一机多工艺”和个性化定制,快速响应市场,降低综合成本。

Digital, mold-free, fast changeover of laser processing perfectly aligns with the multi-variety, fast-iteration trend of accessories. Supports "one-machine-multi-process" and personalization,快速响应 market, lowers overall costs.

深圳镭射奥激光技术有限公司凭借专业的技术团队、定制化的解决方案及完善的售后服务,致力于成为数码配件行业激光精密加工技术的首选合作伙伴。

Shenzhen Laser Ao Technology Co., Ltd., with professional technical teams, customized solutions, and comprehensive after-sales service, is committed to becoming the preferred partner for laser precision processing technology in the digital accessories industry.

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